References¶

Project resources¶

Resource	Location
Assembly Design Kit	IHP-GmbH/IHP-Open-ADK
Toolchain image	IHP-GmbH/ADK-Tools
Chiplet format specification	IHP-GmbH/chiplet-spec
Interposer PDK	IHP-GmbH/OpenIntM4TM2
Interconnect PDK	IHP-GmbH/IHP-Interconnect-IntM4TM2
3D assembly viewer	IHP-GmbH/chiplet-studio
GDS to KiCad converter	IHP-GmbH/gds2kicad
KiCad chiplet export plugin	IHP-GmbH/Chiplets-KiCad-Plugin
KiCad fork	IHP-GmbH/KiCad-ADK-MOD
Base process PDK	IHP-GmbH/IHP-Open-PDK
PDK documentation	https://ihp-open-pdk-docs.readthedocs.io

Bibliography¶

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Yao-Wen Chang. Physical design challenges in modern heterogeneous integration. In Proc. ACM Int. Symp. Physical Design (ISPD). 2024. doi:10.1145/3626184.3639690.

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Dylan Stow, Yuan Xie, Taniya Siddiqua, and Gabriel H. Loh. Cost-effective design of scalable high-performance systems using active and passive interposers. In Proc. IEEE/ACM Int. Conf. Computer-Aided Design (ICCAD), 728–733. 2016. doi:10.1145/2966986.2967048.

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Lingjun Zhu and Sung Kyu Lim. Physical design challenges and solutions for emerging heterogeneous 3D integration technologies. In Proc. ACM Int. Symp. Physical Design (ISPD), 127–134. 2021. doi:10.1145/3439706.3446903.

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IHP GmbH. IHP open PDK – SG13G2 BiCMOS process. 2024. https://github.com/IHP-GmbH/IHP-Open-PDK.

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KiCad Community. KiCad EDA. 2024. https://www.kicad.org/.